Research on design and manufacturing technology of integrated circuit for calibration signal circuit board in 9П516 launching structure

Abstract

This article presents technology for manufacturing hybrid integrated circuits using thick film technology and ceramic materials with passive elements: resistors, capacitors, inductors, conductive paths, and contacts manufactured on the surface. The surface of the insulated base plates uses thick film technology, and the active elements (transistors, diodes, etc.) are installed on the base plate through solder paste technology. Application of hybrid chip technology on the calibration circuit board in the launch mechanism of the air defense complex.