Fabrication and characterization of micromachined piezoresistive displacement sensors

Abstract

Silicon  micromachined  displacement  sensors  have  been  designed  and  fabricated successfully by the MEMS group at ITIMS. The structure of the sensors consists of a membrane with  a  stiff  center.  The  membrane  thickness  is  about  30  microns. The stiff center  serves  as  a forced point and is linked to a movement system.The mechanical signal is converted into output voltage signal by a Wheatstone resistor bridge or afour-terminal gage made by diffusion on the membrane. In this paper, the configuration, fabrication process and characteristics of sensor have been presented.