Analysis of a novel 3C-SiC thin layer on silicon diaphragms for enhanced stress amplification in MEMS piezoresistive pressure sensors

Tóm tắt

This study analyses the square diaphragm structure of a micro-electro-mechanical system (MEMS) pressure sensor using the finite element method (FEM). The research investigates an enhancement in stress distribution achieved by coating a silicon (Si) diaphragm with a thin layer of silicon carbide (3C-SiC)...